A micromachined end-effector along with techniques in micromanipulation for directed micro-electro-mechanical systems (MEMS) assembly is presented. A passive end-effector, fabricated in a 50 µm thick single crystal silicon (SCS) deep reactive ion etched (DRIE) process, is compared with a microgripper made with the same process. With this passive tool, pick and place assembly of MEMS components can be accomplished reliably, since the end-effector is more mechanically robust than comparable microgrippers. This end-effector can withstand an order of magnitude more force than conventional MEMS based microgrippers used for microassembly. In addition, the elimination of any actuation reduces packaging complexity and allows easier integration of sensing mechanisms for feedback control. This simplified passive end-effector with an integrated electrical contact sensor is also presented, along with assembly techniques and designs used for directed pick and place MEMS assembly. Both mechanical and electrical MEMS interconnects are demonstrated.

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A calibration technique is presented here that facilitates automated calibration of a robotic system used for open loop MEMS assembly. A micromechanical calibration device was fabricated in a 20 μm thick electro-plated nickel process as well as a 50 μm thick single crystal silicon, deep reactive ion etched (DRIE) process. This device uses a vision sensing system to detect end-effector position. Results obtained using the calibration device, are presented using a microgripper for pick and place assembly. The relative position of the microgripper and die-site was calibrated to an accuracy of ±1 μm using the described techniques. Microgripper geometry obtained using this technique is also ≤ 3.1 μm of the direct measurement. By utilizing these calibration techniques, the assembly system can be automated to yield a cost-effective microassembly solution.