No abstract

No abstract

Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the Reynolds number, based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during an accidental stoppage of coolant flow due to loss of pumping power. Results compare favorably with those obtained from three-dimensional numerical calculations. The transient correlation recommended is Nul=0.3Fo−0.2Ral*1/4.

No abstract

Experiments have been performed using water to determine the single-phase forced convection heat transfer from in-line four simulated electronic chips, which are flush-mounted to one wall of a vertical rectangular channel. The effects of the most influential geometric parameters on heat transfer including chip number, and channel height are tested. The channel height is varied over values of 0.5, 0.7, and 1.0 times the heat source length. The heat flux is set at the three values of 5 W/cm2, 10 W/cm2, and 20 W/cm2, and the Reynolds number based on the heat source length ranges from 6 × 102 to 8 × 104. Transition Reynolds numbers are deduced from the heat transfer data. The experimental results indicate that the heat transfer coefficient is affected strongly by the number of chips and the Reynolds number and weakly by the channel height. Finally, the present results from liquid-cooling are compared with other results from air-cooling, and Prandtl number scaling between air and water is investigated.