Abstract-A network analyzer with a bulk current injection (BCI) probe is proposed to measure the common-mode conversion coefficient for DC supply loops on a driver PCB of thin film transistor-liquid crystal display (TFT-LCD) panel. The proposed technique is used to predict the common-mode radiated emission caused by the DC supply loops, which highly correlates with the radiated emission measurements obtained for the TFT-LCD panel in a fully anechoic chamber (FAC). The proposed technique is also successful to estimate the reduction of a specific peak in the radiated emission spectrum by shielding the DC supply loops on a driver PCB of TFT-LCD panel. Electromagnetic simulation and equivalent-circuit modeling approaches are developed to confirm the common-mode radiation mechanism in this study.

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Despite the shorter physical length and superior electrical properties of the vertical interconnects, the arrangement of corresponding grounding pins drastically affects the characteristic impedance, resulting in impedance mismatch during the propagation of signals, which leads to signal reflection. Therefore, to potentially overcome this disadvantage, this paper endeavors to establish the analytical model of the vertical interconnects for improving the impedance matching in single-ended configurations. The key approach is to use the method of image charges for analyzing the capacitance between the signal pin and grounding pins of the vertical interconnect.The established models are capable of predicting the changes in the capacitance of various grounding pin arrangements in the vertical interconnect, and based on the prediction results the optimal impedance-matching design can be found.Index Terms -Vertical interconnect, analytical capacitance model, the method of image charges, impedance control.