Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys software was used to evaluate the stress response on the PCB plates during the bending process. Two 3D dimensional PCB plate models, one with through hole and one without hole were developed for the simulation. The stress responses from both these models were compared. Simulation results showed that the value of stress response of the PCB increases with increasing displacement. The through hole PCB model exhibited higher stress compared to the without hole PCB model. Highest stress response was obtained at the displacement height of 5cm.

In this paper, simulation on the bending process of PCB during depaneling was done. The stress response during the bending process was evaluated using a computational program Ansys version 11. Two PCB plate model were developed:one of the model with single hole and other model without hole. The stress responce of the two models were then compared. From the simulation, it has been observed that the value of stress response of the PCB increases with increasing displacement height. The PCB model with single hole exhibited higher stress compared to the PCB model without hole. Highest stress response was obtained at the displacement height of 5cm for both models.