Bio-based epoxy resins with low-dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high-dissociation energy, and elevated molecular volume, thereby making it useful for the synthesis of materials with low dielectric constant and viscosity. Herein, a tetrafunctional eugenol-based epoxy resin (DEP) based on a cyclosiloxane structure was designed and prepared through a hydrosilylation reaction. Allyl glycidyl ether (AGE) was selected as a reference compound and generated a silylation epoxy resin (AGDEP). The viscosity of these siliconecontaining tetrafunctional epoxy monomers (< 0.315 PaÁs) was significantly lower than that of the conventional oil-based epoxy resin (14.320 PaÁs). After curing with methyl hexahydrophthalic anhydride (MHHPA), the dielectric constant of DEP-MHHPA was as low as 2.8 (10 MHz), which was superior to that of EP-MHHPA. Notably, the glass transition temperature (T g ) of DEP-MHHPA was as high as 100.3 C. The tensile strength and elongation at break of DEP-MHHPA were estimated to be 66.1 MPa and 6.0%, respectively.Multifunctional eugenol-based epoxy monomers with low-dielectric constant and viscosity provide an efficient guideline for building epoxy-based materials to better design future-oriented engineering materials.

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Epoxy resins were the most widely used adhesives. Nevertheless, the high dielectric constant (Dk) and dielectric loss (Df) dramatically limited their application in the fifth-generation (5G) technologies. Herein, eugenol epoxy...

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