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She received a bachelor's degree from University of Wisconsin-Madison in 1998 and master's and Ph.D. degrees from Stanford University in 2000 and 2003, all in Materials Science and Engineering. While at Stanford, she studied adhesion of microelectronic packaging interfaces and participated in a number of teaching and mentoring activities. Her current research interests are focused on engineering education research infrastructure, including measures and perceptions of rigor and cross-disciplinary collaboration.

She received a bachelor's degree from University of Wisconsin-Madison in 1998 and master's and Ph.D. degrees from Stanford University in 2000 and 2003, all in Materials Science and Engineering. While at Stanford, she studied adhesion of microelectronic packaging interfaces and participated in a number of teaching and mentoring activities. Her current research interests are focused on engineering education research infrastructure, including measures and perceptions of rigor and cross-disciplinary collaboration.