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The influence of additives on the filling process of via holes in damascene electroplating is investigated with use of a kinetic Monte Carlo method. The basic system is the solid-by-solid model for crystal growth which includes the vacancy formation during the growth of thin film. Three kinds of additives are included in the model to control the local surface growth rate. Inhibitors and levelers have the effect of preventing the deposition, while accelerators increase the local growth rate. Levelers are modeled to stick to the tips of the surface. We performed a series of simulations by changing the parameters which characterize the additives to see their influence on the filling mechanism. It is shown that void-free filling is possible by the combination of the effects of the additives.

The filling process of via holes in damascene electroplating is investigated with the use of kinetic Monte Carlo method. As a model for damascene plating, we included additives in the Solid-by-Solid model which we developed to study the correlation between the surface and void structures during the crystal growth. Two kinds of additives, inhibitors and accelerators, are taken into account to control the local growth rate and to find out the condition for avoiding the void formation during the filling. A series of simulations have been performed by changing the parameters which characterize the additives to see their influence on the filling mechanism. The distribution of additives, the correlation with the resulting surface and void structures are discussed.

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