This paper reports the spectroscopic performance improvement of the silicon-on-insulator (SOI) pixel detector for X-ray astronomy, by introducing a double-SOI (D-SOI) structure. For applications in X-ray astronomical observatories, we have been developing a series of monolithic active pixel sensors, named as “XRPIXs,” based on SOI pixel technology. The D-SOI structure has an advantage that it can suppress a parasitic capacitance between the sensing node and the circuit layer, due to which the closed-loop gain cannot be increased in our conventional XRPIXs with a single-SOI (S-SOI) structure. Compared to the S-SOI XRPIX, the closed-loop gain is doubled in the D-SOI XRPIX. The readout noise is effectively lowered to 33% (16 e− (rms)), and the energy resolution at 6.4 keV is improved by a factor of 1.7 (290 eV in FWHM). The suppression of the parasitic capacitance is also quantitatively evaluated based on the results of capacitance extraction simulation from the layout. This evaluation provides design guidelines for further reduction of the readout noise.

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We report on a measurement of the size of charge clouds produced by X-ray photons in X-ray SOI (Silicon-On-Insulator) pixel sensor named XRPIX. We carry out a beam scanning experiment of XRPIX using a monochromatic X-ray beam at 5.0 keV collimated to ∼ 10 µm with a 4-µmφ pinhole, and obtain the spatial distribution of single-pixel events at a subpixel scale. The standard deviation of charge clouds of 5.0 keV X-ray is estimated to be σcloud = 4.30 ± 0.07 µm. Compared to the detector response simulation, the estimated charge cloud size is well explained by a combination of photoelectron range, thermal diffusion, and Coulomb repulsion. Moreover, by analyzing the fraction of multi-pixel events in various energies, we find that the energy dependence of the charge cloud size is also consistent with the simulation.

A : We have been developing the X-ray silicon-on-insulator (SOI) pixel sensor called XRPIX for future astrophysical satellites. XRPIX is a monolithic active pixel sensor consisting of a high-resistivity Si sensor, thin SiO 2 insulator, and CMOS pixel circuits that utilize SOI technology. Since XRPIX is capable of event-driven readouts, it can achieve high timing resolution greater than ∼ 10 µs, which enables low background observation by adopting the anti-coincidence technique. One of the major issues in the development of XRPIX is the electrical interference between the sensor layer and circuit layer, which causes nonuniform detection efficiency at the pixel boundaries. In order to reduce the interference, we introduce a Double-SOI (D-SOI) structure, in which a thin Si layer (middle Si) is added to the insulator layer of the SOI structure. In this structure, the middle Si layer works as an electrical shield to decouple the sensor layer and circuit layer. We measured the detector response of the XRPIX with D-SOI structure at KEK. We irradiated the X-ray beam collimated with 4 µmφ pinhole, and scanned the device with 6 µm pitch, which is 1/6 of the pixel size. In this paper, we present the improvement in the uniformity of the detection efficiency in D-SOI sensors, and discuss the detailed X-ray response and its physical origins.

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