A non-destructive technique to image the dislocations and other extended defects in SiC epitaxial layers has been developed. Basal plane dislocations (BPDs) and threading dislocations (TDs) are imaged. Photoluminescence from the dislocations is excited with the 364 and/or 351 nm lines of an argon ion laser and near-infrared light is collected. A computer controlled probe station takes multiple images and the mm-sized images are stitched together to form whole-wafer maps. The technique is applied to a set of four n+ wafers from the same boule with 50 um n- epitaxial layers. The epitaxy was grown with Cree’s low-BPD process. BPDs form as either single, isolated dislocations or as clusters encircling micropipes. The concentration of TDs is on the order 104/cm2 and the local concentration varies more than an order of magnitude. The advantages of mapping dislocations by UV-PL imaging compared to other techniques are discussed.

Recent reports have shown that Shockley stacking fault (SSF) growth in 4H-SiC may be reversed via low temperature (210–600°C) annealing. It is not clear if the associated drift in the forward voltage drop (Vf) is also reversed. Here we show that annealing of SSFs causes the complete and repeatable recovery of Vf. Furthermore, by looking at the time-dependent recovery of Vf during both the current stressing and thermal annealing of a single diode, we ascertain that the mechanisms for these two processes are different.

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Improved fabrication and conditioning techniques for gated p-Si field emitter arrays (FEAs) (1×1mm2 in size with 50×50 emitters) greatly reduces the bulk damage and surface states. Consequently, only 0.9μA of the anode dark field-emission current was measured for 50V applied gate potential with a very low gate leakage current. At these low gate leakage currents, the transition between the tunneling-limited field-emission regime and the supply-limited saturation regime is clearly revealed in current-voltage plots. This transition is accompanied by a reduction in the anode current fluctuation. The standard deviation of the noise current drops from a few percent in the tunneling-limited regime to <1% in the supply limited regime at 50V. A photocurrent of 0.41mA was obtained for photoexcitation at 840nm wavelength. This corresponded to 40dB contrast ratio between the photocurrent and the dark current at room temperature. Additionally, our findings showed that surface states were fully depleted at low applied fields, the concentration of bulk defects was low and the area contributing to the dark current was confined to the emitter regions. In contrast, previously reported ungated Si field emitters had high concentrations of surface states and bulk defects. Furthermore, the contributing area to the dark current corresponded to the whole area of the device as opposed to only the emitter areas for a gated FEA. Photofield emission and dark current measurements from our gated p-Si FEA correlate well to theoretical models without requiring cooling to liquid-nitrogen temperatures.

Material defects such as Si-core and C-core partial dislocations (PDs) and threading screw dislocations (TSDs) and threading edge dislocations (TEDs) are being investigated for their contributions to device performances in 4H-SiC. Non-destructive electroluminescence and photoluminescence techniques can be powerful tools for examining these dislocations. In this report, these techniques were used to reveal the different spectral characteristics for the mentioned dislocations. At higher injection levels, both the Si-core and C-core PDs possessed a spectral peak at 700 nm. However, at lower injection levels, the spectral peak for the Si-core PD remained at 700 nm while the peak for the C-core moved to longer wavelengths. For the threading dislocations, TSDs possessed a peak between 800 and 850 nm while the TEDs possessed a peak at 600 nm independent of the injection levels.