Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. During manifactiring processes and in application the bonding layer is repeatedly exposed to temperature changes. Therefore a meaningful stability assessment must consider possible temperature dependent fracture toughness parameters. This work shows that the influence of temperature changes on the fracture toughness depends on whether the bonding layer is subjected to externally pure tensile or combined tensile and shear loading. The reasons for this effect are discussed by use of finite element simulations. Two different kinds of cracks are compared with regard to the residual stresses that result from the wafer bonding process. These residual stresses have a high influence on the loading conditions at the crack tip, when the crack is kinking into the glass frit material. However, the influence of residual stresses on an interfacial crack that propagates parallel to the plan e of the bonding layer is almost negligible
Axisymmetric drop shape analysis-profile (ADSA-P) was combined with total reflectometric interference spectroscopy (TRIS) in one experimental setup to study the interfacial phenomena at solid-liquid and liquid-vapor interfaces caused by adsorption/desorption (dissolution) of surface-active substances. Using sessile liquid droplets on polymer film/chromium-coated glass substrates that were optically matched with an immersion oil to a TRIS reflection prism, the optical thickness (product of physical thickness d and refractive index n) of the polymer film can be estimated by evaluating the wavelength-dependent intensity of reflected light. The sessile droplet is analyzed simultaneously by an ADSA setup arranged in a transverse direction to the path of the white-light beam of TRIS. From this analysis, the solid-vapor interfacial tension gamma (lv)(t), contact angle theta(t), contact radius r(t), drop volume V(t), and solid-liquid interfacial tension gamma (sl)(t) can be monitored as a function of time. The new method was applied to study polystyrene and poly(4-hydroxystyrene) surfaces in contact with aqueous buffer solutions and with protein solutions. The time-dependent changes in the optical film thickness caused by the adsorption of human serum albumin (HSA) and lysozyme (LSZ) were accompanied by changes in the solid-liquid interfacial tension. From the detailed study of both parameters, conclusions can be drawn with regard to the adsorption kinetics of the proteins on the hydrophobic polystyrene surfaces and to conformational changes occurring within the adsorbed protein layers.
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