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This paper presents a robust, low power MEMS igniter built using low pressure chemical vapor deposited (LPCVD) polycrystalline Silicon Carbide films. The MEMS igniter design is based on a 5 µm thick, low stress membrane composed of doped and undoped SiC layers making up the resistive heaters and passivation layer respectively. Experimental tests using an optical pyrometer to measure temperature indicate that this igniter can achieve temperatures beyond 1400°C, with less than 10 W power input, and a time response of less than 0.1 sec. Reliability tests were performed to characterize the igniter behavior as a function of time and determine the lifetime of the devices. Lifetime of the igniter at temperatures greater than 1300°C was limited due to the growth of unstable crystobalite oxide layers resulting in membrane fracture. Reliability significantly improved when operation of the igniter was limited to temperatures below 1100°C.

The high temperature reliability of flex-based Cu/tiecoat/polyimide structures was evaluated through finite element simulation and experimental approach. This study is part of an effort to characterize and optimize polyimide flex as a substrate material for electronics packages rated to greater than 204°C. The peel strength of several common adhesion metals (Ti, Cr, Ni, Cu) on Kapton E was quantified at room temperature and after high temperature storage in inert and highly oxidizing environments. These results were used in tandem with thermal-mechanical simulations to characterize the behavior of several tiecoat materials. Experimental results showed diminished peel strengths of both the Ti and Cr after a 100-hour 250°C heat treatment in air. However when annealed in an inert N2 environment at 250°C for 100 hours, Cr, Ni, and Ti retained their as-sputtered peel strength. Ni and Cu exhibited lower mechanical stresses in the simulation; however, their relatively low reactivity limits their adhesion strength at the interface in oxidizing environments. To further understand the origin of the thermal-mechanical stress, the effect of mismatched CTE was compared to mismatched elastic modulus. Both properties were found to contribute to stress generation; however elastic modulus mismatches had a much greater influence on the overall magnitude of the stress. Through experimentation and FEA analysis this study aims to develop a flexed-based high temperature packaging solution and to shed light onto high temperature tiecoat/polyimide interactions.

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