Plasma spray-physical vapor deposition (PS-PVD) is a low pressure plasma spray technology recently developed by Sulzer Metco AG (Switzerland). Even though it is a thermal spray process, it can deposit coatings out of the vapor phase. The basis of PS-PVD is the low pressure plasma spraying (LPPS) technology that has been well established in industry for several years. In comparison to conventional vacuum plasma spraying (VPS) or low pressure plasma spraying (LPPS), the new proposed process uses a high energy plasma gun operated at a reduced work pressure of 0.1 kPa (1 mbar). Owing to the high energy plasma and further reduced work pressure, PS-PVD is able to deposit a coating not only by melting the feed stock material which builds up a layer from liquid splats but also by vaporizing the injected material. Therefore, the PS-PVD process fills the gap between the conventional physical vapor deposition (PVD) technologies and standard thermal spray processes. The possibility to vaporize feedstock material and to produce layers out of the vapor phase results in new and unique coating microstructures. The properties of such coatings are superior to those of thermal spray and electron beam-physical vapor deposition (EB-PVD) coatings. In contrast to EB-PVD, PS-PVD incorporates the vaporized coating material into a supersonic plasma plume. Owing to the forced gas stream of the plasma jet, complex shaped parts such as multi-airfoil turbine vanes can be coated with columnar thermal barrier coatings using PS-PVD. Even shadowed areas and areas which are not in the line of sight of the coating source can be coated homogeneously. This article reports on the progress made by Sulzer Metco in developing a thermal spray process to produce coatings out of the vapor phase. Columnar thermal barrier coatings made of Yttria-stabilized Zircona (YSZ) are optimized to serve in a turbine engine. This process includes not only preferable coating properties such as strain tolerance and erosion resistance but also the simultaneous coverage of multiple air foils.

Plasma spray-physical vapor deposition (PS-PVD) is a low pressure plasma spray technology to deposit coatings out of the vapor phase. PS-PVD is a part of the family of new hybrid processes recently developed by Sulzer Metco AG (Switzerland) on the basis of the well-established low pressure plasma spraying (LPPS) technology. Included in this new process family are plasma spray-chemical vapor deposition (PS-CVD) and plasma spray-thin film (PS-TF) processes. In comparison to conventional vacuum plasma spraying and LPPS, these new processes use a high energy plasma gun operated at a work pressure below 2 mbar. This leads to unconventional plasma jet characteristics which can be used to obtain specific and unique coatings. An important new feature of PS-PVD is the possibility to deposit a coating not only by melting the feed stock material which builds up a layer from liquid splats, but also by vaporizing the injected material. Therefore, the PS-PVD process fills the gap between the conventional PVD technologies and standard thermal spray processes. The possibility to vaporize feedstock material and to produce layers out of the vapor phase results in new and unique coating microstructures. The properties of such coatings are superior to those of thermal spray and EB-PVD coatings. This paper reports on the progress made at Sulzer Metco to develop functional coatings build up from vapor phase of oxide ceramics and metals.

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Ceramic and cermet coatings on fiber fabrics used in lightweight protection should enhance their performance in stab protection. Based on thermal spray technologies a coating process for hard material layers even on temperature‐sensitive fiber substrates has been developed, so that the coated fabrics retain their flexibility. High‐speed and high‐rate cermet and ceramic coatings are deposited with simultaneous substrate cooling in order to apply thick, hard, and refractory cermet and oxide ceramic coatings. These coatings can be applied on lightweight aramide fabrics without damaging the fibers. The hard material, aramide composite fabric combines the advantages of aramide fabrics and hard, refractory materials. A fully flexible, highly tenacious and lightweight fabric with a hard and refractory top coating is developed. The penetration of knives and blades through such hard material‐coated multilayer fabrics is effectively prevented.

New dedicated coating processes which are based on the well-known LPPSÔ technology but operating at lower work pressure (100 Pa) are being actively developed. These hybrid technologies contribute to improve the efficiencies in the turbine industry such as aero-engines and land-based gas turbines. They also have a great potential in the domain of new energy concepts in applications like Solid Oxide Fuel Cells, membranes, and photovoltaic with the adoption of new ways of producing coatings by thermal spray. Such processes include Plasma Spray-Thin Film (PS-TF) which gives the possibility to coat thin and dense layers from splats through a classical thermal spray approach but at high velocities (400-800 m/ s) and enthalpy (8000-15000 kJ/kg). Plasma Spray-PVD (PS-PVD) which allows producing thick columnar-structured Thermal Barrier Coatings (100-300 lm) from the vapor phase with the employment of the high enthalpy gun and specific powder feedstock material. On the other hand, the Plasma Spray-CVD (PS-CVD) process uses modified conventional thermal spray components operated below 100 Pa which allows producing CVD-like coatings (<1-10 lm) at higher deposition rates using liquid or gaseous precursors as feedstock material. The advantages of such thermal spray-enhanced CVD processes are the high ionization degree and high throughput for the deposition of thin layers. In this article, we present an overview of the possibilities and limitations encountered while producing thin film coatings using liquid and gaseous precursors with this new type of low pressure plasma spray equipment and point out the challenges faced to obtain efficient injection and mixing of the precursors in the plasma jet. In particular, SiO x thin films from Hexamethyldisiloxane (HMDSO or C 6 H 18 OSi 2 ) can be deposited on wafers at deposition rates of up to 35 nm/s at an efficiency of about 50%. The process was also used for producing metal oxide coatings (Al 2 O 3 , ZnO, and SnO 2 ) by evaporating different metals in combination with an oxygen gas flow. The effect of process parameters on the deposition rate, coating build up, uniformity, and quality of the coatings are discussed. An overview of different potential applications of this new technology will be also presented.