As a kind of typical high stacking fault energy materials, recrystallization behavior of high purity Al-0.5%Cu alloy is significantly influenced by the annealing process. In this study, different heating rate, target temperature, and holding time were discovered to have profound impact on the microstructures and textures of Al-0.5%Cu plates. Electron backscatter diffraction (EBSD), scanning electron microscope (SEM), and X-ray diffraction (XRD) were utilized for analyzing the evolution of the microstructure and texture in the subsequent microstructural characterization. Vickers hardness tests were employed for measuring hardness of specimens. The results showed that no obvious recrystallization was observed at lower temperature and the composition of texture influenced by rising temperature, heating rate affected initial recrystallization temperature, grain size, and strength of textures. After recrystallizing completely, the size of microstructures and the distribution of textures had little change with the extension of holding time.