3D display technology has been widely applied in many fields, such as entertainment, education. And also, there is being commercialized recently. Thanks for overdrive technology and multirefresh rate technology, it makes shuttertype glasses 3D stereoscopic technology could be realized in TFT‐LCD display after CRT. The advantage of Shuttertype 3D stereoscopic is no limitation of viewing angle and distance compared to auto stereoscopic display such as barrier type and lenticular type ones. Owing to the different principle of various 3D stereoscopic technologies, 3D image quality measurement should depend on different 3D principle. Therefore, there are still many metrology related to 3D display that need to be defined clearly, especially for crosstalk. Here, we propose a method modified from different from that usually used in nakedeye and glasstype 3D stereoscopic display, an evaluation is suit for shuttertype 3D stereoscopic display.

Abstract— Mura defects become visible in a 13.3‐in. TFT‐LCD using chip‐on‐glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non‐uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC‐driver Si chips. In this paper, a 3‐D finite‐element‐analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper‐glass‐plate post‐COG‐package processing for identifying the root causes of the light‐leakage phenomenon. Prior to that, the simulated warpage results are validated by surface‐contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low‐cost solution for eliminating mura defects.

In this paper, we discuss the light leakage issue of LCD panel occurred due to sharp temperature gradient and non-uniform stress distribution. By using numerical analysis and experiments, the relationship between light leakage and temperature gradient has been discovered. Thermal and stress simulations are applied in the analysis of light leakage phenomenon. Besides, we use simulation tools to predict the effectiveness of solutions for reducing the temperature gradient and stress distribution of LCD glass substrates. Finally, light leakage has been improved by using the rear frame with high thermal conductivity to reduce the temperature gradient and stress of the LCD panel.

A numerical model has been developed to improve the quality of LCD module. By performing CFD analysis, heat transfer behavior for LCD module had been clarified. Designer can solve the issue of heat concentration produced by the electrodes of L shape CCFL to avoid the liquefaction of liquid crystal and the failure of compensation film. Experimental data is used to compare with simulation results and have a consistency in temperature distribution. The developed model has been used to predict the temperature distribution and evaluate the effects of different designs.

Mura is an appearance that indicates low contrast and nonuniform brightness in thin-film transistor liquid-crystal display (TFT-LCD) devices. It is kinds of optical defects, such as ripple, smear, Newton's rings and moiré, etc. This article primarily discusses ripple of optical films by using both experimental and numerical model to help understand how ripple occurs and why ripple seen by inspectors. After performing numerical analysis, we discover the root cause that induces ripple and realize why luminance on film-wrinkled area is varied, finally conclude the parameters that control physical phenomenon.SID 07 DIGEST • 457 ISSN/007-0966X/07/3801-0457-$1.00 © 2007 SID