The use of high performance Integrated Passive Devices (IPD) allows an optimum solution in the tradeoff between integration and flexibility for design modification. The paper presents the integration of sub-circuits into IPD's for WLAN and distributed broadcasting satellite (DBS) applications on Liquid Polymer Crystal (LCP)-based organic substrate technology. An integrated diplexer-coupler-harmonic filter for dual-band WLAN applications and a diplexer-balun chipset for DBS applications are presented. The WLAN IPD measures 5x6mm, exhibits directivities of 27dB and 16dB in the 2.4GHz and 5GHz band, and provides 45dB of second harmonic rejection. The DBS diplexer provides 45dBc rejection. Finally, the 2xl.25mm DBS balun utilizing high-inductive coupling shows a measured amplitude and phase balance of 0.5dB and 50 and a minimum return loss of 10dB.

No abstract

No abstract

No abstract

This paper discusses an improved design flow for hybrid Multi-Chip Modules comprising of MMICs and other components. A full 3D electromagnetic co-simulation flow is proposed. Application of such a flow is demonstrated with an MCM receiver module which has a bulk acoustic wave pre-filter, a Low Noise Amplifier with a digital bypass function, and a classical 6th order filter implemented with discrete components. Detailed simulation data is provided on each component of the system and the final MCM module, that demonstrates the use of the design flow. Finally, simulation results are compared to measured data from fabricated modules to prove the validity of our design approach