Issues relating to the fabrication of complex multichip modules were investigated from a manufacturability perspective. The use of a preimidized photosensitive polyimide reduces the number of processing steps, thus making it a desirable dielectric material. Factors influencing the polyimide resolution, stress, and feature profile were studied both by experimentation and modeling. Thermal cure cycles for polyimide baking were optimized for solvent resistance, polyimide mechanical properties, and process throughput. Studies were also done on polyimide interactions with metal depositions, including adhesion and polyimide surface damage. Results of this research are shown as embodied in a fabricated 1.4 Gbit/s optical transceiver multichip module.