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In this work, we demonstrate that the incorporation of carbon in the base of a npn Si/SiGe/Si heterojunction bipolar transistor dramatically reduces the outdiffusion of boron from the base under postgrowth implantation and annealing procedures. Without the addition of C, these processes would lead to transistors with vastly degraded transistor characteristics. This reduction in B diffusion, when compared to devices without C, has been observed by both secondary ion mass spectroscopy and improved electrical characteristics.

This paper provides a detailed description of the IBM SiGe BiCMOS and rf CMOS technologies. The technologies provide high-performance SiGe heterojunction bipolar transistors (HBTs) combined with advanced CMOS technology and a variety of passive devices critical for realizing an integrated mixed-signal system-on-a-chip (SoC). The paper reviews the process development and integration methodology, presents the device characteristics, and shows how the development and device selection were geared toward usage in mixed-signal IC development.

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