Appropriate control of substrate surface properties prior to inkjet printing could be employed to improve the printing quality of fine resolution structures. In this paper, novel methods to fabricate patterned surfaces with a combination of hydrophilic and hydrophobic properties are investigated. The results of inkjet printing of PEDOT/PSS conductive ink on these modified surfaces are presented. Selective wetting was achieved via a two-step hydrophilic-hydrophobic coating of 3-aminopropyl trimethoxysilane (APTMS) and 3M electronic grade chemical respectively on PET surfaces; this was followed by a selective hydrophilic treatment (either atmospheric O2/Ar plasma or UV/ozone surface treatment) with the aid of a Nickel stencil. Hydrophobic regions with water contact angle (WCA) of 105° and superhydrophilic regions with WCA <5° can be achieved on a single surface. During inkjet printing of the treated surfaces, PEDOT/PSS ink spread spontaneously along the hydrophilic areas while avoiding the hydrophobic regions. Fine features smaller than the inkjet droplet size (approximately 55 μm in diameter) can be successfully printed on the patterned surface with high wettability contrast.

Microfluidics for most bio-related diagnostic applications typically requires single usage disposable chips to avoid bio-fouling and cross-contamination. Individual piece-wise manufacturing of polymeric microfluidic devices has been widely employed in recent years. To significantly lower the manufacturing costs, one possible way is to improve the production yield of polymer microfluidic chips via the hot roller embossing method. This paper discusses the effects of varying the process parameters such as roller temperature, applied pressure and substrate preheating during hot roller embossing (according to a systematic set of experiment designs) and its influence on the corresponding mold to pattern fidelity in terms of normalized embossed depths on the poly(methylmethacrylate) (PMMA) substrate. Concurrently, pattern density studies on the mold were also conducted. Functional testing in terms of fluid flow and micromixing was carried out to evaluate the feasibility of using hot roller embossed PMMA substrates as microfluidic chips.

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As-fabricated deep reactive ion etched (DRIE) silicon mold with very high aspect ratio (>10) feature patterns is unsuitable for poly(dimethylsiloxane) (PDMS) replication because of the strong interaction between the Si surface and the replica and the corrugated mold sidewalls. The silicon mold can be conveniently passivated via plasma polymerization of octafluorocyclobutane (C4F8), which is also employed in the DRIE process itself, to enable the mold to be used repeatedly. To optimize the passivation conditions, we have undertaken a Box-Behnken experimental design on the basis of three passivation process parameters (plasma power, C4F8 flow rate, and deposition time). The measured responses were fluorinated film thickness, demolding status/success, demolding force, and fluorine/carbon ratio on the fifth replica surface. The optimal passivation process conditions were predicted to be an input power of 195 W, a C4F8 flow rate of 57 sccm, and a deposition time of 364 s; these were verified experimentally to have high accuracy. Demolding success requires medium-deposited film thickness (66-91 nm), and the thickness of the deposited films correlated strongly with deposition time. At moderate to high ranges, increased plasma power or gas flow rate promoted polymerization over reactive etching of the film. It was also found that small quantities of the fluorinated surface were transferred from the Si mold to the PDMS at each replication, entailing progressive wear of the fluorinated layer.

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