Thermal management of high power electronics is becoming a critical issue as the power density of semiconductors increasing. The flat heat pipe (FHP) is widely used in the electronic cooling because it is possible to interface with flat electronics packages without additional conductive and interface resistances. The heat flux of the next generation electronics may exceed 100 W/cm2, which is significantly beyond the cooling capabilities of commercially available FHP today. A novel micro scale hybrid wick was developed in this study to improve the effective thermal conductivity and working heat flux of FHP. The hybrid wick consists of multilayer of sintered copper woven meshes to promote the capillary pressure and microchannels underneath to reduce the flow resistance. The analysis indicates that the effective thermal conductivity and the capillary limit of flat heat pipe (FHPs) with this novel micro scale hybrid wicking structure can be significantly enhanced as compared to the reported FHPs. In this paper, the design of this innovative micro scale hybrid wick is illustrated. The fabrication and charging processes are also outlined. The preliminary experimental results show that the effective thermal conductivity can approach 12,270 W/(m·K), which is more than 30 times better than pure copper at approximate 91.3 W input heat.