In high aspect ratio (HAR) dielectric plasma etching, dual-frequency capacitively coupled radio-frequency plasmas operated at low pressures of 1 Pa or less are used. Such plasma sources are often driven by a voltage waveform that includes a low-frequency component in the range of hundreds of kHz with a voltage amplitude of 10 kV and more to generate highly energetic vertical ion bombardment at the wafer. In such discharges, the energetic positive ions can overcome the repelling potential created by positive wall charges inside the etch features, which allows high aspect ratios to be reached. In order to increase the plasma density a high-frequency driving component at several 10 MHz is typically applied simultaneously. Under such discharge conditions, the boundary surfaces are bombarded by extremely energetic particles, of which the consequences are poorly understood. We investigate the charged particle dynamics and distribution functions in this strongly non-local regime in argon discharges by particle-in-cell simulations. By including a complex implementation of plasma-surface interactions, electron induced secondary electron emission (δ-electrons) is found to have a strong effect on the ionization dynamics and the plasma density. Due to the high ion energies at the electrodes, very high yields of the ion induced secondary electron emission (γ-electrons) are found. However, unlike in classical capacitive plasmas, these γ-electrons do not cause significant ionization directly, since upon acceleration in the high voltage sheaths, these electrons are too energetic to ionize the neutral gas efficiently. These γand δ-electrons as well as electrons created in the plasma bulk and accelerated 8 Author to whom any correspondence should be addressed.
The effects of the simultaneous presence of two different types of plasma asymmetry, viz, geometric and electrical, on low-pressure capacitively coupled argon discharges are studied by 2D3V graphics-processing-unit-based particle-in-cell/Monte Carlo simulations. The geometric asymmetry originates from the different powered vs grounded electrode surface areas, while the electrical asymmetry is established by applying peaks/valleys and sawtooth-up/-down driving voltage waveforms. While in geometrically symmetric discharges, the {peaks ↔ valleys} and the {sawtooth-down ↔ sawtooth-up} switching of the waveforms is equivalent to exchanging the powered and grounded electrodes, this transformation is violated when the geometric symmetry is broken. Under such conditions, the plasma characteristics and the DC self-bias generation behave differently, compared to the geometrically symmetric case. This leads to different sheath dynamics and, therefore, strongly influences the electron power absorption dynamics. For identical peak-to-peak voltages, the plasma density obtained for such tailored voltage waveforms is found to be higher compared to the classical single-frequency waveform case. Reduced plasma densities are found in the valleys- and sawtooth-down waveform cases, compared to the peaks- and sawtooth-up waveforms. By including realistic energy and material-dependent secondary electron emission (SEE) coefficients in the simulations, the electron-induced SEE is found to be reduced in the valleys- and sawtooth-down waveform cases, which explains the behaviour of the plasma density. Using such tailored waveforms in geometrically asymmetric discharges is also found to lead to the formation of different charged particle energy distributions at the boundary surfaces, compared to those in geometrically symmetric plasma sources.
Understanding the spatio-temporal dynamics of charged particles in low pressure radio frequency capacitively coupled plasmas (CCP) is the basis for knowledge based process development in these plasma sources. Due to the importance of kinetic non-local effects the particle in cell/Monte Carlo collision (PIC/MCC) simulation became the primary modeling approach. However, due to computational limitations most previous PIC/MCC simulations were restricted to spatial resolution in one dimension. Additionally, most previous studies were based on oversimplified treatments of plasma-surface interactions. Overcoming these problems could clearly lead to a more realistic description of the physics of these plasma sources. In this work, the effects of the reactor geometry in combination with realistic heavy particle and electron induced secondary electron emission coefficients (SEEC) on the charged particle dynamics are revealed by GPU based 2D3V PIC/MCC simulations of argon discharges operated at 0.5 Pa and at a high voltage amplitude of 1000 V. The geometrical reactor asymmetry as well as the SEECs are found to affect the power absorption dynamics and distribution functions of electrons and ions strongly by determining the sheath voltages and widths adjacent to powered and grounded surface elements as well as via the self-excitation of the plasma series resonance. It is noticed that secondary electrons play important roles even at low pressures. Electron induced secondary electrons (δ-electrons) are found to cause up to half of the total ionization, while heavy particle induced secondary electrons (γ-electrons) do not cause much ionization directly, but induce most of the δ-electron emission from boundary surfaces. The fundamental insights obtained into the 2D-space resolved charged particle dynamics are used to understand the formation of energy distribution functions of electrons and ions for different reactor geometries and surface conditions.
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