Abstract：In order to improve the machining quality during truing V-tip of diamond grinding wheel, a tangential grinding truing method is presented. A serial of truing experiments are conducted with the resin-bonded and metal-bonded diamond wheels, and micro grinding experiments on cemented carbide micro structure array also are carried out. Experiments results show that the radius of V-tip of resin-bonded and metal-bonded diamond wheel have been trued to 3.5 μm and 2.0 μm, respectively. The V-tip radius of trued wheel is increased as the increase of feed rate and truing depth per pass, and decreased as the increase of the diamond wheel speed and grain size number of silicon carbide (GC) wheel. Metal-bonded diamond wheel has a lower truing efficiency but a smaller radius of V-tip, compared with resin-bonded diamond wheel. Further, experimental results on micro structure array show that the cemented carbide materials are precisely ground by the trued diamond wheels, a better machining quality are obtained by using the resin-bonded wheel, and it is prone to remove the cemented carbide material in ductile mode.

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