Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich‐structured thermal interface material (TIM) is developed that simultaneously possesses record‐low thermal resistance and high flexibility. Frequency‐domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom‐up fabrication process, excellent contacts between the graphene‐coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2 K W−1. This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics.

Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D graphenenanowire "sandwich" thermal interface that enables an ultralow thermal resistance of ∼0.24 mm 2 •K/W that is about 1 order of magnitude smaller than those of solders and several orders of magnitude lower than those of thermal greases, gels, and epoxies, as well as a low elastic and shear moduli of ∼1 MPa like polymers and foams. The flexible 3D "sandwich" exhibits excellent long-term reliability with >1000 cycles over a broad temperature range from −55 °C to 125 °C. This nanostructured thermal interface material can greatly benefit a variety of electronic systems and devices by allowing them to operate at lower temperatures or at the same temperature but with higher performance and higher power density.

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Metasurfaces consisting of an array of planar sub-wavelength structures have shown great potentials in controlling thermal infrared radiation, including intensity, coherence, and polarization. These capabilities together with the two-dimensional nature make thermal metasurfaces an ultracompact multifunctional platform for infrared light manipulation. Integrating the functionalities, such as amplitude, phase (spectrum and directionality), and polarization, on a single metasurface offers fascinating device responses. However, it remains a significant challenge to concurrently optimize the optical, electrical, and thermal responses of a thermal metasurface in a small footprint. In this work, we develop a center-contacted electrode line design for a thermal infrared metasurface based on a gold nanorod array, which allows local Joule heating to electrically excite the emission without undermining the localized surface plasmonic resonance. The narrowband emission of thermal metasurfaces and their robustness against temperature nonuniformity demonstrated in this work have important implications for the applications in infrared imaging, sensing, and energy harvesting.

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