Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler.

Myclobutanil is a triazole fungicide with low toxicity and easily biodegradable so that it can be used as an alternative corrosion inhibitor in metal pickling. Myclobutanil was studied as a corrosion inhibitor of Cu in 0.5M HNO3 solutions by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and scanning electron microscopy (SEM). Electrochemical test show that myclobutanil is an effective inhibitor and the inhibition efficiency equal approximately to 93.7% when the inhibitor concentrations were fixed in 1mM.

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