No abstract

New interconnect materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications. Among all the conductive-adhesive materials, the anisotropic conductive adhesives (ACA) (or anisotropic conductive adhesive films, ACF) have gained popularity as a potential replacement for solder interconnects. For ACF interconnection, thermo-compression (T/C) bonding is the most common method. In this study, the effects of the some important processing parameters, including the increasing rate of bonding temperature and different Teflon films, on the reliability of the ACF joints were investigated. Results show that the performances of the ACF joints were affected by the distribution of conductive particles and the curing degree of the ACF, which was determined by the bonding temperature ramp rates. The bonding strengths of ACF joints are different for the different Teflon film's thickness and kinds.