The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm3 (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.
Ag and Cu have different advantages and are widely used in key fields due to their typical highly electrical and thermal conductive (HETC) properties. Laser powder bed fusion (LPBF), an innovative technology for manufacturing metallic multi-material components with high accuracy, has expanded the application of Ag–Cu in emerging high-tech fields. In this study, the multi-material sandwich structures of Ag7.5Cu/Cu10Sn/Ag7.5Cu were printed using LPBF, and the formation mechanism, interface characteristics, and molten pool behavior of the Ag7.5Cu/Cu10Sn (A/C) and Cu10Sn/Ag7.5Cu (C/A) interfaces were studied to reveal the influence of different building strategies. At the A/C interface, pre-printed Ag7.5Cu promoted Marangoni turbulence at a relatively low energy density (EA/C = 125 J/mm3). Due to the recoil pressure, the molten pool at the A/C interface transformed from a stable keyhole mode to an unstable keyhole mode. These phenomena promoted the extensive migration of elements, forming a wider diffusion zone and reduced thermal cracking. At the C/A interface, the molten pool was rationed from the conduction mode with more pores to the transition mode with fewer defects due to the high energy density (EC/A = 187.5 J/mm3). This work offers a theoretical reference for the fabrication of HETC multi-material structures via LPBF under similar conditions.
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