The aim of this paper is to describe the Smart Polygeneration Microgrid (SPM), which is going to be constructed at the Savona Campus of the Genoa University, also thanks to funding from the Italian Ministry of Education, University and Research. Besides producing renewable and high efficiency energy for the University Campus, the SPM will constitute a test-bed facility for research, development and testing of management strategies, devices and components for smart grid applications. The main features of this infrastructure will be outlined, pointing out its peculiarities, such as the use of the IEC 61850 protocol and a close integration between electric and heating networks. Furthermore, the activities which will be carried out thanks to the SPM and the challenges in its operation and optimal management will be discussed, in the context of the current research on microgrid and smart grid technologies.

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The aim of this paper is to describe the Smart Polygeneration Microgrid (SPM) test-bed facility at the Savona Campus of the Genoa University. The SPM constitutes a pilot plant for research, development and testing of management strategies, devices and components for smart grid applications. The main features of this infrastructure will be outlined, focusing on its power and communication architecture, based on the use of the IEC 61850 protocol and on a close integration between electric and heating networks. Furthermore, the activities which will be carried out thanks to the SPM and the challenges in its operation and optimal management will be reported, in the context of th grid and smart grid technologies

The paper proposes a model for the thermal network of the Savona Campus Smart Polygeneration Microgrid (SPM) in terms of an equivalent electric circuit. Such model allows to represent in a simple but accurate way the behavior of the SPM thermal network in order to insert it into the Energy Management System (EMS) that is presently running in the SPM control room. The parameters of the thermal circuit are identified by means of an algorithm that minimizes the difference between the temperature profile as calculated with the circuit and the measured one