Market demands for lightweight and lower cost products drive manufacturers to improve current product portfolios. In the case of electronic devices, the most significant weight originates from the enclosure, traditionally in steel or aluminum, that ensures excellent mechanical and electromagnetic shielding performance. The use of thermoplastics filled with electrically conductive fibers, such as carbon or stainless steel, was investigated as a lightweight and cost-effective alternative to steel sheet for creating electromagnetic interference (EMI) shielding enclosures for electronic devices. This paper presents an EMI shielding analysis workflow for the development of plastic enclosures for an electronic device. The workflow starts by measuring the fiber-reinforced thermoplastic compounds shielding effectiveness (SE) with an experimental method in the 30 MHz–3 GHz frequency band. This analysis helps to filter a vast list of materials with a wide range of shielding performance, 20–100 dB, and allows to obtain empirical data for the second phase of the workflow, computer simulations. Simulations with experimentally adjusted material properties were used to validate the design concept of an enclosure in its early development phase. Results from this study showed that the selected material has better EMI SE performance than a steel sheet venting grid.

This research introduces an analysis of the anisotropic electrical resistivity (ER) and its relation to the electromagnetic shielding effectiveness (EMSE) for two injection‐molded carbon‐fiber‐reinforced polybutylene terephthalates (PBTs). The properties were measured for 2‐mm thick injection moldings considering the effect of melt temperature, injection velocity, and flow distance. The results for one compound showed an EMSE in the range of 30–40 dB, while EMSE for a compound with lower filler content is in the range of 45–75 dB. A combination of higher temperature and higher velocity leads to an increase of EMSE for both compounds in the range of 3%–8.5%. However, the increase in flow path reduced the EMSE for both compounds up to 10%. A novel experimental apparatus was used to measure the anisotropic ER in the three directions, that is, parallel, perpendicular, and transversal to flow. It is evident that injection molding induced high anisotropy for both compound specimens, and, depending on the processing conditions, produced similar longitudinal resistivity (0.2–4 Ω.cm) but higher transversal resistivity (8–22 Ω.cm). ER properties were compared with EMSE, evidencing an inverse relation as expected. Furthermore, it was found that the longitudinal resistivity is the main contributor to the specimens shielding.

Thermoplastic composites integrating carbon nanotubes (CNT) and micron-sized metal particles dispersed in polymer matrices can address emerging multifunctional needs, e.g., good electrical conductivity and electromagnetic interference (EMI) shielding combined with easy processing and affordable costs. Herein, an approach based on reactive microencapsulation is reported to prepare polyamide 6 (PA6)-based composites comprising binary loads of CNT and Al, Cu, or Fe particles. The microencapsulation is performed by activated anionic polymerization of ε-caprolactam in solution, in the presence of the metal/CNT loads. The resulting hybrid microparticles are compression-molded into plates containing effective metal/CNT loads in the range of 12–17 wt %. Among the materials synthesized, the one containing Al/CNT binary load (3:7 wt %) displays the highest EMI shielding effectiveness (SE) of 43.5 dB at 12 GHz, with a 2 mm thickness and an electrical conductivity σdc of 6.61 × 10–3 S/cm. A synergetic effect is observed in all of the metal/CNT PA6 samples in terms of both σdc and SE increase. Evidently, the presence of metal particles well dispersed in the conductive CNT network contributes to the mobility of the carriers and thus to the effective attenuation of the electromagnetic waves. Therefore, the binary composites of this study can be efficient thermoplastic EMI shielding materials.

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