This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN's back-contact modules performance and reliability. Damp-heat (85˚C; 85% R.H) and thermal cycling (-40˚C; +85˚C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.

Aims: Back-contact metallization-wrap-through (MWT) modules made with different materials were manufactured and tested at ECN in The Netherlands. Study Design: Damp heat testing (DH, 85°C and 85% relative humidi ty) was performed to investigate the effect of the module materials and potential failure mechanisms on electrical performance degradation.