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A comprehensive study of rock properties is crucial to investigate and characterize the behavior of rock when it undergoes multiple loading and stresses. The properties of rocks are heavily influenced by weathering grade and the composition of minerals which indicates the hardness, swelling potential and abrasiveness, therefore give an effect on the strength and the durability of rocks. The interaction between mineralogy and engineering properties are significantly important for the engineer to fully understand the behavior of mudrock for further application especially in Malaysia. Selected weathered mudrocks from Bukit Kukus Kedah, a part of Semanggol formation were characterized for physical, mechanical and mineral properties. The result shows the degree of weathering influenced the physical and mechanical properties of mudrock. The sample with low porosity and high density possessed highest slake durability index of 91.43%. X-Ray diffraction revealed two of the sample tested were consists of goethite and quartz. The sample presence with goethite is higher in durability compare to sample consists of quartz only due to the cementation effect and denser minerals.

We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or test key) separating product die on the wafer [1]. The motivation of this work is to establish the baseline of the dielectric and device reliability for the kerf PCM structure that will enhance the capability to perform lot disposition in the event of PCM test out-of-control (OOC). Different test structures will be stressed and correlation study is performed with existing models. The experiment was performed at Infineon Technologies Kulim Failure Analysis Lab and that test wafers were fabricated by Infineon Technologies.

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