have been performed in a temperature range from 1023 to 1123K. The concentration profiles indicate that the diffusion rate of Sn is greater than that of Ni in these solid solutions. The influence of the indirect flux becomes larger with increasing Ni concentration. The interdiffusion fluxes evaluated from the equations of Dayananda and Kim show that the zero-flux planes exist in the diffusion zone of Cu-Ni-Sn couples. The diffusion paths show S-shaped curves. The direct coefficients DCuSnSn and DCuNiNi are positive, and the indirect coefficients DCuSnNi and DCuNiSn are negative. The four interdiffusion coefficients are very sensitive to the Ni and Sn concentrations. The temperature dependence of DCuSnSn,DCuSnNi,DCuNiNi and DCuNiSn at the composition of Cu-6.0 at%Ni-3.7 at%Sn can be expressed by the following equations:and The estimated values of interaction parameters indicate that the interaction energy of the Ni-Sn bond is much larger than those of the Cu-Sn and Cu-Ni bonds.

No abstract

No abstract

No abstract

No abstract