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Very low surface recombination velocities <6 and <11 cm/s were obtained for SiOx/a-SiNx:H stacks synthesized by plasma-enhanced chemical vapor deposition on low resistivity n- and p-type c-Si, respectively. The stacks induced a constant effective lifetime under low illumination, comparable to Al2O3 on p-type Si. Compared to single layer a-SiNx:H, a lower positive fixed charge density was revealed by second-harmonic generation measurements, while field-effect passivation was absent for a reference stack comprising thermally grown SiO2. The results indicate that hydrogenation of interface states played a key role in the passivation and remained effective up to annealing temperatures >800 °C.

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Surface passivation schemes based on Al2O3 have enabled increased efficiencies for silicon solar cells. The key distinguishing factor of Al2O3 is the high fixed negative charge density (Qf = 10 12 -10 13 cm -2 ), which is especially beneficial for p-and p+ type c-Si, as it leads to a high level of field-effect passivation. Here we discuss the properties of Al2O3 surface passivation films synthesized with plasma atomic layer deposition (ALD), thermal ALD (using H2O as oxidant) and PECVD. We will show that with all three methods a high level of surface passivation can be obtained for Al2O3 deposited at substrate temperatures in the range of 150-250 o C. Furthermore, the role of chemical and field-effect passivation will be briefly addressed. It is concluded that the passivation performance of Al2O3 is relatively insensitive to variations in structural properties. Al2O3 is therefore a very robust solution for silicon surface passivation.

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