Continuous, real-time monitoring of the level of pH and free chlorine in drinking water is of great importance to public health. However, it is challenging when conventional analytical instruments, such as bulky pH electrodes and expensive free chlorine meters, are used. These instruments have slow response, are difficult to use, prone to interference from operators, and require frequent maintenance. In contrast, microfabricated electrochemical sensors are cheaper, smaller in size, and highly sensitive.Therefore, these sensors are desirable for online monitoring of pH and free chlorine in water. In this review, we discuss different physical configurations of microfabricated sensors. These configurations include potentiometric electrodes, ion-sensitive field-effect transistors, and chemo-resistors/transistors for electrochemical pH sensing. Also, we identified that micro-amperometric sensors are the dominant ones used for free chlorine sensing. We summarized and compared the structure, operation/sensing mechanism, applicable materials, and performance parameters in terms of sensitivity, sensing range, response time and stability of each type of sensor. We observed that novel sensor structures fabricated by solution processing and operated by smart sensing methodologies may be used for developing pH and free chlorine sensors with high performance and low cost. Finally, we highlighted the importance of the concurrent design of materials, fabrication processes, and electronics for future sensors.
Thin copper ͑Cu͒ films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at room temperature using the surface activated bonding method. A low energy Ar ion beam of 40-100 eV was used to activate the Cu surface prior to bonding. Contacting two surface-activated wafers enables successful Cu-Cu direct bonding. The bonding process was carried out under an ultrahigh vacuum condition. No thermal annealing was required to increase the bonding strength since the bonded interface was strong enough at room temperature. The chemical constitution of the Cu surface was examined by Auger electron spectroscope. It was observed that carbon-based contaminations and native oxides on copper surface were effectively removed by Ar ion beam irradiation for 60 s without any wet cleaning processes. An atomic force microscope study shows that the Ar ion beam process causes no surface roughness degradation. Tensile test results show that high bonding strength equivalent to bulk material is achieved at room temperature. The cross-sectional transmission electron microscope observations reveal the presence of void-free bonding interface without intermediate layer at the bonded Cu surfaces.
For heterogeneous integration in many More-than-Moore applications, surface preparation is the key step to realizing well-bonded multiple substrates for electronics, photonics, fluidics and/or mechanical components without a degradation in performance. Therefore, it is critical to understand how various processing and environmental conditions affect their surface properties. In this paper, we investigate the effects of oxygen plasma and humidity on some key surface properties such as the water contact angle, roughness and hardness of three materials: silicon (Si), silicon dioxide (SiO 2) and glass, and their impact on bondability. The low surface roughness, high surface reactivity and high hydrophilicity of Si, SiO 2 and glass at lower activation times can result in better bondability. Although, the surface reactivity of plasma-ambient-humidity-treated Si and SiO 2 is considerably reduced, their reduction of roughness and increase of hydrophilicity may enable good bonding at low temperature heating due to augmented hydroxyl groups. The decrease of hardness of Si and SiO 2 with increased activation time is attributed to higher surface roughness and the formation of amorphous layers of Si. While contact angle and surface roughness results show a correlation with bondability, the role of hardness on bondability requires further investigation.
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