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In future high performance digital systems both electrical and optical communication networks are to perform high speed digital functions. Accurate assessment of the performance parameters of these technologies for high speed digital applications has substantial economic implications and, in turn, places requirements for both the development of modeling and simulation tools as well as for the integration of such techniques and tools for the analysis of high performance systems of high complexity. Fot this purpose, several approaches to the solution of a number of classes of problems are implemented and evaluated. The dispersive properties of heterogeneous electrical propagating channels are determined on the basis of full-wave vector solutions which have been experimentally validated to approximately 230 GHz. A generalized coupled mode theory approach is implemented for analyzing the dispersive phenomena in dielectrically inhomogeneous electrically coupled networks as well as for simulating optical signal degradation effects in imperfect optical waveguides. Precision modeling of dispersive, damping and mode coupling effects in electrical channels are illustrated and compared to degradation effects in optical waveguides by accurate simulation of digital waveform propagati()fl. Discussion of methods and results is presented. Technological advantages and disadvantages of these interconnecting methods are evaluated and discussed on the basis of predicted signal integrity and are illustrated with specific examples.

In this paper we introduce an improved RF dielectric measurement technique based on the Agilent 4291A Impedance Analyzer and 16453A Dielectric M a t e e l Test Fixture covering frequencies ranging from 1 MHz to 1GHz The measurement structure is a simple parallel plate capacitor with the material under test serving as the dielectric. Obtaining consistent data requires careful sample preparation and accurate alignment between the 16453A electrodes. We describe our procedures for creating jW, polished, metallized samples starting with encapsulant samples in their liquid form. Data for a variety of encapsulants are shown. The technique is readily extendable to solid materials, and we include data for selected samples of LTCC substrates as well as a MAPBGA molding compound.