Abstrucf-A fluxgate-like magnetometer using planar technology has been developed. The performance is comparable to conventional fluxgates. Due to minor inductive and capacitive effects of the planar coils, higher exciting frequencies can be used.

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The problems of heat conduction in hybrid thin and thick film circuits have been investigated using both analytical and numerical approaches.The calculations were restricted to two dimensions by assuming zero temperature gradient across the thickness of the substrate (slightly more than half millimeter).All normally recognized parameters were taken into consideration, such as film temperature, power dissipated, substrate area, etc.Allowances have also been made for lead conduction and connection technology, for horizontal or vertical circuit assembly, and for flush or stand-off mounting on the mechanical support.The measured results for practical cases show close agreement with the theoretical calculations.This approach provides a simple tool for the calculation, at an early design stage of power handling capacities of hybrid circuits using composite resistive configurations.Very little difference was found between temperatures predicted from the theoretical approach and those measured in practical cases of circuits under load.The availability of such accurate design information means that the stability, life, and reliability of hybrid circuits can be predicted with considerable accuracy at an early design stage.

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The new Low Temperature Cofired Ceramic process combines the advantages of thick film standard and cofired ceramic technologies for the implementation of high interconnection density hybrid circuits, at a reasonable cost. Due to the wide diversity of devices required in the telecommunications field, it is important to have for drilling and scribing a system capable of being easily integrated onto a LAN, in order to reduce the machine preparation time, using all the information already existing in CAD. As laser systems are standard in thick film production, the investments involved to implement a new technology are minimised. This paper describes the use of laser technology for drilling green ceramic to achieve interconnection paths between different levels, manufacturing of screen mask (via metallisation), and scribing of substrates already synthesised. A preliminary characterisation of Telettra's technology follows.