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The ultrasonically assisted machining is suitable to achieve sub-millimeter drilling on difficult-to-cut materials such as ceramics, hardened steel, glass and heat-resistant steel. However, it is difficult to observe the high-frequency and micron-scale phenomenon of ultrasonic cutting. In this report, high speed camera based on photoelastic analysis realized the visualization of stress distribution on drilling process. For the conventional drilling, the stress distribution diagram showed the intensive stress occurred under the chisel because the chisel edge of drill produces large plastic deformation. On the other hand, the ultrasonic drilling produced spread stress distribution and stress boundary far away from the chisel. Furthermore, chipping or cracking of inner wall of silica glass was influenced considerably by cutting fluid.