a b s t r a c tElectroplated tin finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, the spontaneous growth of tin whiskers during service can result in localised electrical shorting or other harmful effects. Until recently, the growth of tin whiskers was successfully mitigated by alloying the tin with lead. However, restriction in the use of lead in electronics as a result of EU legislation (RoHS) has led to renewed interest in finding a successful alternative mitigation strategy.Whisker formation has been investigated for a bright tin electrodeposit to determine whether whisker growth can, at least partially, be mitigated by control of electroplating parameters such as deposition current density and deposit thickness. The influence of substrate material and storage at 55°C/85% humidity on whisker growth have also been investigated.Whisker growth studies indicate that deposition parameters have a significant effect on both whisker density and whisker morphology. As deposition current density is increased there is a reduction in whisker density and a transition towards the formation of large eruptions rather than potentially more harmful filament whiskers. Increasing the tin coating thickness also results in a reduction in whisker density. Results demonstrate that whisker growth is most prolific from tin deposits on brass, whilst that from tin deposits on rolled silver is greater than that observed for tin deposits on copper.

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Since the 'cracked oxide theory' was proposed by Tu in 1994 [1], there has only been a limited number of studies that have sought to investigate the effect of the Sn oxide on whisker growth. The current study has used electrochemical oxidation to produce oxide films, which has enabled the effect of the surface oxide thickness on whisker growth to be established. The effect of oxide thickness on whisker growth has been investigated for tin electrodeposits on both Cu and brass substrates. The influence of applied oxidation potential on the thickness of the Sn oxide film has been investigated using x-ray photoelectron spectroscopy (XPS) for potassium bicarbonate-carbonate and borate buffer electrolyte solutions. Whisker growth from electrochemically oxidised Sn-Cu deposits on Cu and Sn deposits on brass has been investigated and compared with samples left to develop a native air-formed oxide. XPS studies show that the thickness of the electrochemically formed Sn oxide film is dependent on the applied oxidation potential and the total charge passed.Subsequent whisker growth studies demonstrate that electrochemically oxidised Sn-Cu deposits on Cu and Sn deposits on brass are significantly less susceptible to whisker growth than those having a native oxide film. For Sn deposits on brass, the electrochemically formed Sn oxide greatly reduces Zn oxide formation at the surface of the tin deposit, which results in whisker mitigation. For Sn-Cu deposits on Cu, the reduction in whisker growth must simply derive from the increased thickness of the Sn oxide, i.e. the Sn oxide film has an important role in stemming the development of whiskers.

Electroplated zinc finishes have been associated with the electronics industry for many years as a result of their excellent corrosion resistance and relatively low cost. They are normally applied onto ferrous products to provide corrosion protection in a range of different environments. However, the formation of spontaneously grown whiskers on zinc electroplated components, which are capable of resulting in electrical shorting or other damaging effects, can be highly problematic for the reliability of long life electrical and electronic equipment. The growth of zinc whiskers has been identified as the cause of some electrical and electronic failures in telecommunications and aerospace based applications, with consequences ranging from mild inconvenience to complete system failures.Investigators have been striving to address the problems induced by whisker growth since the 1940s. However, most research effort has been focused on tin whiskers; especially following European Union environmental legislation that restricted the use of lead (Pb), which when alloyed with tin (3 -10% by weight) provided effective tin whisker mitigation. Compared with tin whisker research, much less attention has been paid to zinc whiskers. A number of mechanisms to explain zinc whisker growth have been proposed, but none of them are widely accepted and some are in conflict with each other. The aim of this paper is to review the available literature in regard to zinc whiskers; to discuss the reported growth mechanisms, to evaluate the effect of deposition parameters and to explore potential mitigation methods. This paper presents a chronologically ordered review of zinc whisker related studies from 1946 to 2013. Some important early research, which investigated whisker growth in tin and cadmium, as well as zinc, has also been included.

It is widely documented that whisker growth is more rapid for tin deposits on brass compared with deposits produced on other substrate materials, such as copper. As a result, studies investigating the effect of process variables on tin whisker formation are often conducted on brass substrates to take advantage of the increased whisker growth rates. Although it has been understood since the 1960's that the increased whisker growth results from zinc diffusion, to date there has not been any detailed analysis of the zinc/zinc oxide distribution at the surface of the tin deposit. Using a commercial bright tin electroplating bath, the formation of zinc oxide at the surface of tin deposits on brass has been investigated. The distribution of the zinc oxide and its development as a function of storage time has been studied. The effect of an electrochemical oxidation treatment, immediately after tin deposition, on zinc oxide formation and subsequent whisker growth has also been investigated. Analyses show that zinc oxide is present on the surface of the deposit within one day of electroplating. During storage at room temperature a network of zinc oxide is formed at the surface grain boundaries, the extent of which increases with time. The critical role that zinc diffusion plays in whisker growth for tin deposits on brass has been demonstrated by electrochemical oxidation of the tin shortly after electroplating. This develops a tin oxide film that is thicker than the native air formed oxide and subsequently serves as a diffusion barrier to zinc surface diffusion, thereby mitigating whisker growth.