3-D Modeling of copper electrodeposition in a copper sulfate solutions was carried out using COMSOL Multiphysics. The results of the model were validated using experimental plating cells of different geometries. A new empirical equation was developed to predict deposit thickness on protruding or recessed features in a plating cell with accuracy comparable to the COMSOL model.

Modeling and simulations can be cost effective ways of predicting the behavior of an electroplating system, and many mathematical models have been developed to describe an electrolyte’s current distribution, however the models are usually restricted to specific simplified geometries such as flat panels, rotating discs, or triangular geometries. Various software packages have been developed that allow for three dimensional modeling, however very little information validating such models has been published in literature. In this study models of copper electrowinning and copper plating have been developed using Comsol Multiphysics software and have been validated using experimental plating and electrowinning cells. The Comsol Multiphysics models are also compared with empirical models in this study. The results show a good correlation between the models and the experimental data for a variety of cathode geometries and electrodeposition parameters.