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In-plane bend loss represents the greatest commercial inhibitor to deploying multimode optical waveguides on densely populated electro-optical printed circuit boards (OPCB) as the minimum bend radii currently possible are too large to be practical in common designs. We present a concept and fabrication method for creating novel polymer optical waveguide structures with reduced bend losses to enable higher density routing on an OPCB. These nested core waveguide structures comprise a core surrounded by a thin shell of cladding, which allows for twofold modal containment by first a conventional low refractive index contrast (LIC) boundary followed by a secondary high refractive index contrast (HIC) boundary. The purpose of this is to reduce the in-plane bend losses incurred on tightly routed optical channels, while not incurring prohibitive dispersion, sidewall scattering and optical crosstalk penalties. We have designed and fabricated nested core multimode polymer waveguides, evaluated their performance in comparison to conventional step-index waveguides and simulated these structures using the beam propagation method. Preliminary results are presented of our measurements and simulations.

The increasing demand for planar polymer optical waveguides integrated into electrical printed circuit boards (PCB) calls for mass production capabilities: Hence, appropriate materials, systems, assembly concepts and production technologies become vital, in order to guarantee a high reproducibility and quality of the waveguides. The manufacturing and assembly costs have to be kept on a low level, while the integration of the highly sensible waveguides into the rough environment of PCB's with their cheap and non-ideal substrates is a particular challenge.The present paper describes an assembly and manufacturing technology for electro-optical circuit boards which meets these requirements.First, the manufacturing and characterization of multimode polymer waveguides is presented and the process for layer deposition and structuring is described. Specific attention is given to the reproducibility of these processes ensuring the high optical quality of the waveguides. Additionally, some problems arising from the integration of the waveguides into the PCB's are discussed.Second, various light coupling concepts are presented. In particular, a novel mirror element based on parabolic reflectors is described. The optical design was calculated analytically and optimized using computer simulations. The mirror element was fabricated using injection molding in a reproducible manner at high quantities and lowest cost.To allow for a wider tolerance in the subsequent assembly steps our novel electro-optical transceivers concept facilitates the use of conventional SMD-placement machines for mounting which makes the process very cost effective. This concept was demonstrated successfully and is also described within the third section.In the last part the practical use of this building set is illustrated with different successfully realized applications in the field of ICT and optical sensor technology.