Encapsulation is essential for mechanically flexible and electrically active implants as it protects them from the harsh environment inside the body. Since the performance and longevity of implants depends on the quality of encapsulation, research continues into new and better encapsulation strategies. Chemical vapour deposition can be used to deposit Parylene-C, a biocompatible polymer, at room temperature. Plasma enhanced atomic layer deposition can be used to deposit ultra-thin, conformal, and hermetic metal oxide layers. These strategies are both used for the encapsulation of implants. In this work, these two methods are combined to create a polymer/metal oxide hybrid system in which a layer system of metal oxides is sandwiched between two Parylene- C layers. DC leakage-current measurement and elevated temperature are used to qualify the barrier property of the layer-system. After more than one year, the barrier properties still show no significant decrease.