Lignin functions as an essential polymer in plants that forms the plant body's structural framework. The natural glue holds the cellulosic fibers together in the plant body, thereby providing rigidity and strength. Despite this, lignin shows promising relevance for biomaterial production due to its abundance, nontoxic nature and biodegradability. Considerably, adhesive components were derived from petroleum, which is increasingly more expensive. Hence, lignin, the natural glue in plant materials, gained much popularity because of its phenolic nature, making it an attractive substitute for adhesives. Lignin‐based binders are produced through phenols substitution in phenol‐formaldehyde resins with lignin due to their similar structural framework. Many researchers have confirmed the multifunctional applications of lignin, such as wood adhesive in fiber board, plywood and particleboard, a binder in printed wiring boards, abrasive tools, epoxy asphalts, epoxy wood composites, 3D printing, adhesive hydrogels, soil suppressants, lignocellulosic paper and coatings. This review presents a comprehensive description of the utilization of lignin‐based binders for different applications. The present work highlights the discussion on the various methods by which lignin can be used to replace synthetic binders. This review focuses on global research work introducing lignin in different chemical adhesives for a more cost‐effective and less harmful alternative.

Recently 3D printing or additive manufacturing has been one of the most popular techniques for fabricating material. 3D printing or additive manufacturing has taken over the modern material fabrication industry in a revolutionary manner. The present review focuses on designing electromagnetic interference (EMI) shielding materials by 3D printing. The various raw materials such as polylactic acid (PLA), polypropylene, graphene, carbon nanotube (CNT), multiwalled carbon nanotube (MCNT), and so forth, can be successfully used for making effective EMI shielding performances in different frequency ranges.These raw materials have prepared diverse shapes, dimensions, and compositions to attenuate the incident radiations over the shielding material's surface and ultimately protect the electronic devices. When mixed with carbon nanotubes, PLA has been shown 8-15 dB, 30 dB, and 67 dB EMI SE in different frequency ranges, a material with ABS and CNT have À3 to À16 dB reflection loss in X-band frequency. Also graphene nanofilm/MWCNT composition has shown EMI SE as high as 43-54 dB in X-band ranges when printed with poly jet printing. These properties gave a cutting-edge rivalry to the conventional fabrication method and proved that 3D printing is better when designing innovation for EMI shielding materials3D printing, additive manufacturing, carbon nanotube, EMI shielding materials, fused filament fabrication, polylactic acid, polymer composites, polypropylene | INTRODUCTIONElectromagnetic (EM) radiations are generated by accelerated charged particles such as an electron. Both electric and magnetic fields propagate perpendicular to each other and are transverse. Electromagnetic radiation can travel in any medium such as vacuum, air, water, solids, and so forth. [1] Based on their energy and frequency, these radiations are classified into ionizing and nonionizing radiations. Ionizing radiations are very high frequency, high-energy radiations (X-rays, γ-rays, etc.), and nonionizing radiations are low frequency and low-energy

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