A new solution-based method to fabricate Cu(2)ZnSn(S,Se)(4) (CZTSSe) thin films is presented. Binary and ternary chalcogenide nanoparticles were synthesized and used as precursors to form CZTSSe thin films. The composition of the CZTSSe films can be easily controlled by adjusting the ratio of the nanoparticles used. The effect of compositional adjustment on device performance is illustrated. Laboratory-scale photovoltaic cells with 8.5% total-area efficiency (or 9.6% active-area efficiency) were demonstrated without anti-reflective coatings. Material characterization data revealed the formation of a bilayer microstructure during thermal processing and suggested a path forward on device improvement.
This letter reports interdigitated back contact silicon heterojunction (IBC-SHJ) solar cells which combine the performance benefits of both back contact and heterojunction technologies while reducing their limitations. Low temperature (<200°C) deposited p- and n-type amorphous silicon used to form interdigitated heteroemitter and contacts in the rear preserves substrate lifetime while minimizes optical losses in the front. The IBC-SHJ structure is ideal for diagnosing surface passivation quality, which is analyzed and measured by internal quantum efficiency and minority carrier lifetime measurements. Initial cells have independently confirmed efficiency of 11.8% under AM1.5 illumination. Simulations indicate efficiencies greater than 20% after optimization.
The structure of hydrogenated silicon (Si:H) films deposited by rf and dc plasma process on Si (100) and (111) wafers is correlated with the surface passivation quality and heterojunction cell performance. Microstructural defects associated with SiH2 bonding and apparent ion bombardment in dc plasmas have little or no adverse effect on passivation or cell properties, while presence of crystallinity in Si:H i layer severely deteriorates surface passivation and cell open circuit voltage (Voc). Excellent surface passivation (lifetime of >1ms) and high efficiency cells (>18%) with Voc of 694mV are demonstrated on n-type textured Czochralski wafer using dc plasma process.
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