Thermal management has become one of the most challenging issues for highpower, integrated, and miniaturized electronic devices. In this paper, an alumina ceramic heat sink with mini-channels was fabricated using a digital light processing 3D printing technology. Microstructures of the ceramic were investigated by scanning electron microscopy. A proper flow rate of water in the mini-channels was figured out for efficient cooling by infrared thermal imaging and microthermocouple characterizations. The ceramic heat sink was further integrated with a high-power laser diode module; cooling performance was evaluated by investigating the thermal resistance of the ceramic heat sink and the optoelectronic property of the laser diode module. Results indicated that the laser diode module could be operated at high driving power of 115.6 W. This study provided a new strategy for a highly efficient thermal management of electronic devices and highlighted the technical potential of ceramic heat sink with more compact coolant channels.

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