Evidence-based practice has been demonstrated to positively impact patient outcomes; unfortunately, there are many factors that hinder the use of research evidence by healthcare clinicians. Our previous study reported a multisite survey assessing Australian perioperative nurses knowledge, practice, attitude, and perceived barriers to evidence use. This subsequent analysis used univariate and multivariate binary logistic regression with odds ratios (OR) and 95% confidence intervals (CI) to compare individual nurse and organisational characteristics with high evidencebased practice (EBP) use. Two individual nurse characteristics found to be related to EBP were postgraduate qualifications (OR 1.69, 95% CI 1.07-2.6, p=0.02) and previous research experience (OR 1.9, 95% CI 1.6-2.4, p=0.01). Organisational characteristics related to EBP included access to the internet (OR 2.04, 95% CI 1.3-3.0, p=0.001) and access to ongoing EBP education (OR 1.6, 95% CI 1.1-2.5, p=0.01). Previous research experience (OR 1.6, 95% CI 1.0-2.3, p=0.01) was the only independent predictor of EBP. Given our finding, we suggest that considerably greater effort be made to facilitate nurses involvement in research studies in the perioperative setting.

As Silicon Substrate Hybrid Wafer Scale or Multichip Module (MCM) Technology makes the transition from the feasibility study, research and development and demonstrator activities of the eighties towards real manufacture in the early nineties, the substrate test structures employed are required to make a related transition, with changes in both design and function. This paper explores the variety of test structures that may be employed in the fabrication and assembly of silicon substrate Multichip Modules that aim at Wafer Scale complexity levels, with particular reference to their technological role.

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Mu1 t i c h i p module technology provides an advanced method f o r connecting integrated c i r c u i t chips together t o produce a c i r c u i t assembly w i t h minimum chip-to-chip spacing. provided w i t h a dense p a t t e r n o f interconnections. on t h i s substrate are f i n e r than those t h a t are possible i n conventional hybrid c i r c u i t s . I n t h i s paper, the emphasis i s placed on m u l t i c h i p modules based on s i l i c o n h y b r i d technologies where s i l i c o n substrates, metal tracks and organic i n t e rl e v e l d i e l e c t r i c are used. Processes f o r manufacturing such substrates have been developed a t GEC-Marconi Materials Technoloqy. The type o f a l l o y s s u i t a b l e f o r forming the metal tracks and the methods available f o r depositing and patterning such a l l o y s w i l l be discussed. choices and t h e i r implications on the manufacturability o f the substrate w i l l be considered. techniques which can be used f& patterning i t t o provide vias between the metal layers are also discussed. The mu1 t i -l a y e r interconnect structures produced underwent s t r u c t u r a l analysis and the e l e c t r i c a l i n t e g r i t y was assessed. The naked I C chips are attached t o a substrate which i s The metal track widths The r e l a t i v e m e r i t s o f these The c r i t e r i a f o r choosing an organic d i e l e c t r i c and the