Barrier coatings against plasticizer leaching are deposited on flexible polyvinylchloride (PVC) films typically used in flooring or in the automotive industry. Octamethylcyclotetrasiloxane (OMCTS) and hexamethyldisiloxane (HMDSO) are plasma polymerized using plasma‐activated CVD (PA‐CVD) based on an atmospheric pressure (AP) dielectric barrier discharge (DBD). A reduction in plasticizer leaching higher than 80% is achieved with these coatings. The effect of the monomer flow rate, discharge power, and oxygen flow rate on the barrier efficiency is investigated. The coating composition of the best barrier coating has been identified and the long‐time barrier efficiency in contact with an organic solvent has been studied.

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With the gaining demand for SiC semiconductor devices it is more and more challenging to meet the requirements for SiC volume production with the state of the art wafer dicing technology. In order to overcome this challenge the laser based dicing technology Thermal Laser Separation (TLS-DicingTM) was assessed for SiC volume production within the European project SEA4KET. This paper presents the key results of this project. It could be demonstrated that the demand of SiC volume production regarding throughput and cost as well as edge quality and electrical performance of diced chips can be met with TLS-DicingTM.