No abstract

No abstract

Short design cycles for integrated circuits and packages drive the need for efficient problem solving and rapid results. Improved mechanical modeling software and increased computing power have taken these computation-heavy tools and made them versatile enough to support main-stream, real-time production needs. The utility of these tools has been significantly improved by simplified work flows to create detailed geometries and complex assemblies, improved mesh generation algorithms, and solve time reduction. Mechanical modeling software has a wide range of application which traditionally has been focused on design of large structures. Despite their general applicability, these tools have not been optimized for microelectronics in terms of absolute dimensions, fine structure count, and range of scale from the smallest to the largest component. Finding solutions to these problems pays off in fewer design cycles and significant process yield improvements. This paper will show multiple examples of process-induced stress, driven by material properties and manufacturing. They have been created using a variety of FEM tools, including ANSYS and Abaqus.