The synthesis of two versatile building blocks for supramolecular anion binding motifs, 5‐(N‐Boc‐guanidinocarbonyl)‐1H‐pyrrole‐2‐carboxylic acid (1) and 5‐(N‐Cbz‐guanidinocarbonyl)‐1H‐pyrrole‐2‐carboxylic acid (2) is reported. Using these building blocks, a guanidiniocarbonyl‐pyrrole anion binding site can easily be introduced into more complex molecules by using standard amide coupling conditions. Both syntheses can be performed on a multi‐gram scale. The products are obtained in pure form and can be stored as solids without decomposition. (© Wiley‐VCH Verlag GmbH & Co. KGaA, 69451 Weinheim, Germany, 2008)

Kinetic studies of a low-molecular weight organocatalyst 1 are presented. Compound 1 contains two histidines and one cationic side chain attached to a central aromatic core. In aqueous solution 1 accelerates the hydrolysis of a prototypal phosphodiester with rate enhancements of up to two orders of magnitude. A detailed HPLC analysis of hydrolysis experiments in Bis-Tris-buffer showed that the buffer itself can act as a nucleophile at least with the cyclic phosphate 16. Compound 1 is also an efficient host for the binding of bis-(para-nitrophenyl)-phosphate 14 with extraordinary high affinity of K(ass) = 24,400 M(-1) in buffered water.

Recently the use of Copper as a conductor material for Thin Film Transistor (TFT) structures has received increasing attention in the Flat Panel Display industry [1,2]. Since sputtering of thick Cu layers has serious disadvantages Flat Panel Display (FPD) manufacturers are considering wet chemical Cu deposition as a viable process alternative. Depending on the required film properties like conductivity and surface roughness either electroless or electrolytical Copper deposition can be applied.

pH‐dependent dimerization: Zwitterionic polyglycerol dendrons self‐assemble into discrete and well‐defined dimers in water as shown by dynamic light scattering (DLS), gel permeability chromatography (GPC), and DOSY NMR spectroscopy. However, self‐assembly occurs only at neutral pH as either protonation or deprotonation destroys the self‐complementary zwitterionic binding motif in the core of the dendrimer. Hence, structure formation can be triggered back and forth by changing the pH of the solution.

Inorganic interposers made of glass are attractive for advanced high frequency applications and ultra- fine line patterning technology. Because glass combines a couple of benefits like large form factor, good coefficient of thermal expansion (CTE) matching to silicon, smooth surface and a low dielectric constant and loss tangent. Recently much progress has been made with respect to glass electrical and physical properties. This allows for handling of thin glass sheets down to 100 μm in a typical PCB panel format. Also advances have been made in the area of laser drilling allowing aspect ratio up to 1:10 for 25 μm diameter of through glass via (TGV). Another major challenge is the cost competitive and reliable metallization of smooth glass, a critical prerequisite for the use of glass substrates in the electronic packaging market. Plated copper does not adhere directly to glass. Sputtering technology typically also requires a 50 nm thick adhesion promoting metal layer (like Ti) before copper can be seeded. This metal layer could not be etched together with the copper and needs to be removed between traces by etching in an additional step. A volatile flammable solvent based metal oxide precursor coating solution has been used to make an adhesive metal oxide layer by a modified sol-gel process. To prevent potential safety issue for mass production water based metal oxide precursor coating solution so called VitroCoat GI W has been developed. The VitroCoat GI W solution can be dip-coated on flat glass surface and TGVs followed by sintering to form an ultrathin metal oxide adhesion layer (about 10nm). The thin adhesive layer enables electroless and electrolytic copper plating directly onto glass substrates without changing any of the glass properties or impacting high frequency performance. The thin metal oxide adhesive layer is non-conductive and can be easily removed from the area between circuit traces. This paper will focus on the coating uniformity and capability of VitroCoat GI W on flat glass surface and TGVs and the adhesion of wet chemical metallization on glass interposer. This adhesion layer can be used for copper fine line patterning on glass and radio frequency (RF) device fabrication.