The growth of linear cell colony fronts is investigated from the morphology of cell monolayer colonies, the cell size and shape distribution, the front displacement velocity, and the dynamic scaling analysis of front roughness fluctuations. At the early growth stages, colony patterns consist of rather ordered compact domains of small cells, whereas at advanced stages, an uneven distribution of cells sets in, and some large cells and cells exhibiting large filopodia are produced. Colony front profiles exhibit overhangs and behave as fractals with the dimension D(F)=1.25±0.05. The colony fronts shift at 0.22±0.02 μm  min(-1) average constant linear velocity and their roughness (w) increases with time (t). Dynamic scaling analysis of experimental and overhang-corrected growth profile data shows that w versus system width l log-log plots collapse to a single curve when l exceeds a certain threshold value l(o), a width corresponding to the average diameter of few cells. Then, the influence of overhangs on the roughness dynamics becomes negligible, and a growth exponent β=0.33±0.02 is derived. From the structure factor analysis of overhang-corrected profiles, a global roughness exponent α(s)=0.50±0.05 is obtained. For l>200 μm, this set of exponents fulfills the Family-Vicsek relationship. It is consistent with the predictions of the continuous Kardar-Parisi-Zhang model.

The dynamics of two-dimensional (2D) radially spreading growth fronts of Vero cell colonies was investigated utilizing two types of colonies, namely type I starting from clusters with a small number of cells, which initially exhibited arbitrary-shaped rough growth fronts and progressively approached quasicircular ones as the cell population increased; and type II colonies, starting from a relatively large circular three-dimensional (3D) cell cluster. For large cell population colonies, the fractal dimension of the fronts was D(F) = 1.20±0.05. For low cell populations, the mean colony radius increased exponentially with time, but for large ones the constant radial front velocity 0.20±0.02 μm min(-1) was reached. Colony spreading was accompanied by changes in both cell morphology and average size, and by the formation of very large cells, some of them multinuclear. Therefore the heterogeneity of colonies increased and local driving forces that set in began to influence the 2D growth front kinetics. The retardation effect related to the exponential to constant radial front velocity transition was assigned to a number of possible interferences including the cell duplication and 3D growth in the bulk of the colony. The dynamic scaling analysis of overhang-corrected rough colony fronts, after arc-radius coordinate system transformation, resulted in roughness exponent α = 0.50±0.05 and growth exponent β = 0.32±0.04, for arc lengths greater than 100 μm. This set of scaling exponents agreed with that predicted by the Kardar, Parisi, and Zhang continuous equation. For arc lengths shorter than 2-3 cell diameters, the value α = 0.85±0.05 would be related to a cell front roughening caused by temporarily membrane deformations occasionally interfered by cell proliferation.

Copper electrodeposition on copper from still plating solutions of different compositions was investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry, and scanning electron microscopy (SEM). An acid copper sulphate plating base solution was employed either with or without sodium chloride in the presence of a single additive, either polyethylene glycol (PEG) or 3-mercapto-2propanesulphonic acid (MPSA), and their mixture. Thallium underpotential deposition/anodic stripping was employed to determine the adsorption capability of additives on copper. In the absence of chloride ions, MPSA shows a moderate adsorption on copper, whereas PEG is slightly adsorbed. At low cathodic overpotentials, the simultaneous presence of MPSA and chloride ions accelerates copper electrodeposition through the formation of an MPSA-chloride ion complex in the solution, particularly for about 220 mM sodium chloride. The reverse effect occurs in PEG-sodium chloride plating solutions. In this case, from EIS data the formation of a film that interferes with copper electrodeposition can be inferred. At higher cathodic overpotentials, when copper electrodeposition is under mass transport control, the cathode coverage by a PEG-copper chloride-mediated film becomes either partially or completely detached as the concentration of chloride ions at the negatively charged copper surface diminishes. The copper cathode grain topography at the mm scale depends on the cathodic overpotential, plating solution composition and average current density. Available data about the solution constituents and their adsorption on copper make it possible to propose a likely complex mechanism to understand copper electrodeposition from these media, including the accelerating effect of MPSA and the dynamics of PEG-copper chloride complex adsorbate interfering with the surface mobility of depositing copper ad-ions/ad-atoms.