Abstract-In this paper we introduce an automated Bayesian visual inspection framework for Printed Circuit Board (PCB) assemblies, which is able to simultaneously deal with various shaped Circuit Elements (CE) on multiple scales. We propose a novel Hierarchical Multi Marked Point Process (H M MPP) model for this purpose, and demonstrate its efficiency on the task of solder paste scooping detection and scoop area estimation, which are important factors regarding the strength of the joints. A global optimization process attempts to find the optimal configuration of circuit entities, considering the observed image data, prior knowledge, and interactions between the neighboring CEs. The computational requirements are kept tractable by a data driven stochastic entity generation scheme. The proposed method is evaluated on real PCB data sets containing 125 images with more than 10.000 splice entities.

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to develop a new method of evaluating the present state of X-ray machines used in the electronics device manufacturing industry. Design/methodology/approach -There are several kinds of failures that can only be detected by means of X-ray inspection. The capabilities and properties of such machines, however, alter over a period of time. The effects of these changes are rarely published and when they are, the significance and reliability of the results produced depends very much on the state and capabilities of the machines in question. Findings -The effectiveness and appropriateness of the present methods of calibration have been investigated. The optimization of the prevalence and effectiveness of these calibrations is described. Suggestions are also made as to the necessary adjustments or repairs that are required to reach the ideal optimized state of X-ray machines. A scientifically substantiated method is also presented that can be efficiently employed in practise during automated X-ray inspections of electronic devices. Originality/value -In this paper, a new method of testing automated X-ray inspection systems is introduced. It is clear that the method currently used by many engineers and inspection system manufacturers is not in itself sufficient, as they do not test grey-scale and positioning stability in relation to changes that occur over time. Further, there is no evidence that numerical testing of the image quality takes place. Detailed investigations have been carried out to find the best methods to measure these parameters.

Purpose -The purpose of this paper is to develop a novel automatic and accurate measurement technique for the volume of solder which is present in solder paste in pin-in-paste (PIP) technology and a calculation algorithm for predicting solder joint quality. Design/methodology/approach -A new method is described for accurately determining the volume of solder alloy in solder paste that is present in and around the through hole, using X-ray measurements (orthogonal view X-ray images, instead of angle view), image processing and other calculations. In addition, various calibration tool constructions are investigated and a method is suggested for determining the calibration curve (for each solder paste) of an X-ray machine. Findings -A new calibration tool has been developed to accurately measure the calibration curve of X-ray machines. Based on several tests, a fast and reliable image processing method for measuring the average grey scale of each pasted through hole is described. Numerous PIP solder joints have been created then analysed using the methodology. To verify the efficiency of the described methods, joints are soldered and inspected using cross-sectioning and X-ray imaging. Originality/value -Calibration curve measurement of an X-ray machine is done with the help of the developed tool for PIP technology. Orthogonal view X-ray images are used to measure the volume of printed solder alloy (paste). During the image processing, circle fitting has been simplified to line fitting.

Today, pin-in-paste technology is used extensively. With the help of pin-in-paste, through-hole devices can be soldered using a standard surface mount technology (SMT) process and hereby a reduction in wave soldering is possible. This can result in cost savings and a decrease in production cycle time. To ensure successful pin-in-paste soldering the following steps must be taken: solder paste volume calculations for through-hole components; stencil aperture design for the pin-in-paste application; solder paste deposition through stencil printing, application of solder volume increasing techniques after printing; reflow profile optimization; inspections using special methods for each individual process; final tests.The paste is printed into the through-holes. For high quality pin-in-paste solder joints a sufficient volume of paste is a fundamental requirement. Nevertheless, after printing the throughhole-filling is usually unknown.In this paper a new method is described how to accurately determine the volume of solder alloy in solder paste that is present in the through-hole, using X-ray measurements, image processing and calculations. In addition, a method is suggested to determine the measuring characteristics and gray-scale linearity of the X-ray machine. Keywords X-ray image • pin-in-paste • volume measurement • qualification.