In this paper we present a silicon wafer bonding technique for 3D microstructures using MEMS process technology. Photo-definable material with patternable characteristics served as the bonding layer between the silicon wafers. A bonding process was developed and several types of photo-definable material were tested for bonding strength and pattern spatial resolution. The results indicated that SU-8 is the best material with a bonding strength of up to 213 kg cm−2 (20.6 MPa), and a spatial resolution of 10 μm, at a layer thickness of up to 100 μm. The low-temperature bonding technique that is presented is particularly suitable for microstructure and microelectronics integration involved in MEMS packaging.
Machining tools based on the excimer laser and x-ray lithography to make ultra-fine machining tool/molds are described in this paper. The lower high-aspect ratio resist molds are fabricated using the KrF excimer laser. The higher aspect-ratio resist molds are made using x-ray lithography. Both low and high aspect-ratio resist molds are then converted into metallic structures using electroforming. The NiCo/SiC microcomposite electroforming with low internal stress (∼0 kg mm −2 ) and high hardness (>Hv500) shows its feasibility as mold materials. An example of 2 mm thick integrated circuit (IC) packaging leadframe patterns using x-ray micromachining is illustrated to prove its feasible application. On the technical side, micro-structures with a high aspect ratio of 30 were developed using a graphite membrane based x-ray mask.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.