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A series of cyclic monomers were polymerized by free-radical polymerization and used as polymer binders in negative-type photoresists. Thermal properties of the polymer binders and mechanical properties of the pattern were studied. We used four-component polymer binders consisting of methacrylic acid, styrene, isobornyl methacrylate (IBMA), and phenylmaleimide (PMI). The glass transition temperature (T g ) and thermal decomposition temperature (T d ) of polymer binders increased with PMI content because of the rigid characteristics of PMI's molecular structure. Elastic recovery and compression of the patterns were measured using a nanoindenter. The patterns exhibited excellent mechanical properties, presumably due to the rigid characteristics of PMI and IBMA's molecular structures. Patterns of a photo spacer were observed by scanning electron microscopy. Addition of carboxylic acid segments of a cross-linker improved the effectiveness of development in negative-type photoresists, and conical patterns were obtained due to decreased intensity of the inter-penetration network.